Double-Sided Wafer Lapper Ring from Canada
Conditioning ring for double-sided lapping machines processing semiconductor wafers simultaneously on both surfaces for ultimate flatness. HTS 8451.90.90 as lapping equipment parts per statistical notes. Distributes slurry evenly across multiple wafers in carrier plates.
Duty Rate — Canada → United States
13.5%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide ring material (resin, stainless) and slurry flow groove specifications
• Document conditioning frequency and lapper plate diameter compatibility