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8451.80.00.00/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Automated polisher for final surface finishing of semiconductor wafers to mirror-like flatness required for device fabrication, covered in statistical notes for wafer grinders, lappers, and polishers under HTS 8451.80.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Provide CMP (chemical mechanical polishing) process details for accurate heading

• Label as 'semiconductor-specific' to distinguish from textile machinery

Semiconductor Wafer Polisher from Japan — Import Duty Rate | HTS 8451.80.00.00