8451.80.00.00/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Automated polisher for final surface finishing of semiconductor wafers to mirror-like flatness required for device fabrication, covered in statistical notes for wafer grinders, lappers, and polishers under HTS 8451.80.00.00.

Duty Rate — Japan → United States

13.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide CMP (chemical mechanical polishing) process details for accurate heading

• Label as 'semiconductor-specific' to distinguish from textile machinery

Semiconductor Wafer Polisher from Japan — Import Duty Rate | HTS 8451.80.00.00