Semiconductor Wafer Polisher

Automated polisher for final surface finishing of semiconductor wafers to mirror-like flatness required for device fabrication, covered in statistical notes for wafer grinders, lappers, and polishers under HTS 8451.80.00.00.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.5%+35.0%38.5%
🇲🇽Mexico3.5%+10.0%13.5%
🇨🇦Canada3.5%+10.0%13.5%
🇩🇪Germany3.5%+10.0%13.5%
🇯🇵Japan3.5%+10.0%13.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.40Lower: 14.4% vs 38.5%

If vacuum insulated or for direct wafer polishing

Semiconductor notes place most wafer polishers in 8460 for processing.

8421.19.00.00Lower: 36.3% vs 38.5%

If classified as centrifugal textile cleaning machinery analog

Surface cleaning functions overlap with textile washing machinery.

9031.49Lower: 10% vs 38.5%

If with integrated flatness testing optics

Measuring/testing apparatus for semiconductor surfaces under Chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide CMP (chemical mechanical polishing) process details for accurate heading

Label as 'semiconductor-specific' to distinguish from textile machinery