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8448.32.00.90/Wafer Thickness Lapper/Mexico

Wafer Thickness Lapper from Mexico

Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Certify lapping pressure systems for wafer fragility handling

• Separate from polishers in shipments to maintain 'other' status