Other
Auxiliary machinery for use with machines of heading 8444, 8445, 8446 or 8447 (for example, dobbies, Jacquards, automatic stop motions and shuttle changing mechanisms); parts and accessories suitable for use solely or principally with the machines of this heading or of heading 8444, 8445, 8446 or 8447 (for example, spindles and spindle flyers, card clothing, combs, extruding nipples, shuttles, healds and heald-frames, hosiery needles): > Parts and accessories of machines of heading 8445 or of their auxiliary machinery: > Of machines for preparing textile fibers, other than card clothing > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8448.32.00.90
Wafer Grinder Spindle
Precision spindles for high-speed rotation in semiconductor wafer grinders/lappers, classified HTS 8448.32.0090 as parts of 8445 fiber prep machines. Critical for dimensional accuracy in statistical note equipment.
Semiconductor Fiber Comb Assembly
Comb assemblies adapted for aligning semiconductor crystal fibers or filamentary materials in prep machines, under 'other' HTS 8448.32.0090 excluding card clothing. Analogous to textile combs but for advanced fibers.
Wafer Prep Extruding Nipple
Extruding nipples for precise slurry or fiber extrusion in semiconductor wafer preparation lines, HTS 8448.32.0090 parts for 8445 machines. Matches example in heading for fiber processing accessories.
Monocrystalline Boule Trimmer
Boule trimmers cut ends and shape monocrystalline semiconductor ingots prior to grinding, fitting HTS 8448.32.0090 auxiliaries. Prepares fibers/boules per Chapter 84 notes for 8445 machines.
Wafer Surface Grinder
Wafer surface grinders flatten back sides of semiconductor wafers to tight tolerances, as 'other' under HTS 8448.32.0090. Supports statistical note equipment for wafer preparation post-slicing.
Czochralski Crystal Puller
A Czochralski crystal puller is auxiliary machinery used to produce monocrystalline silicon boules from which semiconductor wafers are sliced, classified under HTS 8448.32.0090 as parts and accessories for machines of heading 8445 for preparing textile fibers in semiconductor contexts. It falls here due to its role in fiber-like crystal growth processes akin to textile preparation equipment.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity monocrystalline semiconductor boules using zone melting, suitable as auxiliary machinery for 8445 fiber preparation machines under HTS 8448.32.0090. This classification applies to its principal use in preparing semiconductor 'fibers' or boules analogous to textile fibers.
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal boules to exact diameters and flats indicating conductivity, classified as accessories for 8445 fiber prep machines in HTS 8448.32.0090. It supports wafer manufacturing by preparing boule dimensions like textile fiber processing tools.
Semiconductor Wafer Slicing Saw
Wafer slicing saws cut thin wafers from monocrystalline semiconductor boules, fitting as 'other' parts for 8445 textile fiber prep machines per HTS 8448.32.0090 statistical notes. Essential for semiconductor wafer manufacturing equipment in fiber processing analogy.
Wafer Edge Grinder
Wafer edge grinders shape and bevel semiconductor wafer peripheries for handling and processing, under HTS 8448.32.0090 as accessories for 8445 fiber preparation. Aligns with statistical note (C) for wafer grinders in semiconductor manufacturing.
Crystal Flat Lapper
Crystal flat lappers grind orientation flats on semiconductor boules to denote doping type, classified in HTS 8448.32.0090 for 8445 auxiliary machinery. Supports wafer prep per statistical notes by ensuring boule flatness tolerances.
Semiconductor Wafer Polisher
Wafer polishers achieve mirror-flat surfaces on semiconductor wafers for fabrication, as 'other' accessories under HTS 8448.32.0090 for heading 8445 machines. Directly matches statistical note for lappers/polishers in wafer preparation.
Boule Diameter Grinder
Boule diameter grinders reduce crystal boules to uniform wafer-matching diameters, fitting HTS 8448.32.0090 as parts for textile fiber prep machines (8445). Per notes, used in semiconductor crystal grinding for precise wafer production.
Wafer Thickness Lapper
Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.
Crystal boule Slicer Blade Assembly
Specialized blade assemblies for inner-diameter saws slicing semiconductor boules into wafers, classified as accessories in HTS 8448.32.0090 for 8445 prep machines. Matches note (B) wafer slicing saw components.