Wafer Thickness Lapper from Japan
Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify lapping pressure systems for wafer fragility handling
• Separate from polishers in shipments to maintain 'other' status