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8448.32.00.90/Wafer Thickness Lapper/Japan

Wafer Thickness Lapper from Japan

Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Certify lapping pressure systems for wafer fragility handling

• Separate from polishers in shipments to maintain 'other' status

Wafer Thickness Lapper from Japan — Import Duty Rate | HTS 8448.32.00.90