8448.32.00.90/Wafer Thickness Lapper/Japan

Wafer Thickness Lapper from Japan

Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify lapping pressure systems for wafer fragility handling

• Separate from polishers in shipments to maintain 'other' status

Wafer Thickness Lapper from Japan — Import Duty Rate | HTS 8448.32.00.90