8448.32.00.90/Wafer Thickness Lapper/Germany

Wafer Thickness Lapper from Germany

Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Certify lapping pressure systems for wafer fragility handling

• Separate from polishers in shipments to maintain 'other' status