Wafer Thickness Lapper from Germany
Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify lapping pressure systems for wafer fragility handling
• Separate from polishers in shipments to maintain 'other' status