</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8448.32.00.90/Wafer Thickness Lapper/Canada

Wafer Thickness Lapper from Canada

Wafer thickness lappers thin-slice semiconductor wafers to exact specifications for device fabrication, under HTS 8448.32.0090. Aligns with statistical provisions for grinders/lappers in semiconductor wafer prep equipment.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Certify lapping pressure systems for wafer fragility handling

• Separate from polishers in shipments to maintain 'other' status

Wafer Thickness Lapper from Canada — Import Duty Rate | HTS 8448.32.00.90