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8448.32.00.90/Wafer Surface Grinder/Mexico

Wafer Surface Grinder from Mexico

Wafer surface grinders flatten back sides of semiconductor wafers to tight tolerances, as 'other' under HTS 8448.32.0090. Supports statistical note equipment for wafer preparation post-slicing.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document grind wheel compositions for semiconductor compatibility

• Use ISPM-15 compliant crates for delicate vacuum chucks