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8448.32.00.90/Wafer Surface Grinder/Japan

Wafer Surface Grinder from Japan

Wafer surface grinders flatten back sides of semiconductor wafers to tight tolerances, as 'other' under HTS 8448.32.0090. Supports statistical note equipment for wafer preparation post-slicing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document grind wheel compositions for semiconductor compatibility

• Use ISPM-15 compliant crates for delicate vacuum chucks

Wafer Surface Grinder from Japan — Import Duty Rate | HTS 8448.32.00.90