8448.32.00.90/Wafer Surface Grinder/Germany

Wafer Surface Grinder from Germany

Wafer surface grinders flatten back sides of semiconductor wafers to tight tolerances, as 'other' under HTS 8448.32.0090. Supports statistical note equipment for wafer preparation post-slicing.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document grind wheel compositions for semiconductor compatibility

• Use ISPM-15 compliant crates for delicate vacuum chucks

Wafer Surface Grinder from Germany — Import Duty Rate | HTS 8448.32.00.90