Wafer Surface Grinder from Germany
Wafer surface grinders flatten back sides of semiconductor wafers to tight tolerances, as 'other' under HTS 8448.32.0090. Supports statistical note equipment for wafer preparation post-slicing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document grind wheel compositions for semiconductor compatibility
• Use ISPM-15 compliant crates for delicate vacuum chucks