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8448.32.00.90/Wafer Grinder Spindle/Japan

Wafer Grinder Spindle from Japan

Precision spindles for high-speed rotation in semiconductor wafer grinders/lappers, classified HTS 8448.32.0090 as parts of 8445 fiber prep machines. Critical for dimensional accuracy in statistical note equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• RPM/torque ratings must specify semiconductor wafer loads

• Balance certificates prevent vibration reclass to general parts

Wafer Grinder Spindle from Japan — Import Duty Rate | HTS 8448.32.00.90