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8448.32.00.90/Wafer Edge Grinder/Japan

Wafer Edge Grinder from Japan

Wafer edge grinders shape and bevel semiconductor wafer peripheries for handling and processing, under HTS 8448.32.0090 as accessories for 8445 fiber preparation. Aligns with statistical note (C) for wafer grinders in semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include photos/drawings of edge profiling for customs verification

• Certify no use outside 8445/wafer prep to prevent reclass to general grinders

Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8448.32.00.90