Wafer Edge Grinder from Germany
Wafer edge grinders shape and bevel semiconductor wafer peripheries for handling and processing, under HTS 8448.32.0090 as accessories for 8445 fiber preparation. Aligns with statistical note (C) for wafer grinders in semiconductor manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include photos/drawings of edge profiling for customs verification
• Certify no use outside 8445/wafer prep to prevent reclass to general grinders