Wafer Edge Grinder from China
Wafer edge grinders shape and bevel semiconductor wafer peripheries for handling and processing, under HTS 8448.32.0090 as accessories for 8445 fiber preparation. Aligns with statistical note (C) for wafer grinders in semiconductor manufacturing.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include photos/drawings of edge profiling for customs verification
• Certify no use outside 8445/wafer prep to prevent reclass to general grinders