Semiconductor Wafer Slicing Saw from Japan
Wafer slicing saws cut thin wafers from monocrystalline semiconductor boules, fitting as 'other' parts for 8445 textile fiber prep machines per HTS 8448.32.0090 statistical notes. Essential for semiconductor wafer manufacturing equipment in fiber processing analogy.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit blade specs showing diamond-wire for semiconductor materials only
• Document integration with crystal pullers (8445 auxiliaries) for correct heading