Semiconductor Wafer Slicing Saw from China
Wafer slicing saws cut thin wafers from monocrystalline semiconductor boules, fitting as 'other' parts for 8445 textile fiber prep machines per HTS 8448.32.0090 statistical notes. Essential for semiconductor wafer manufacturing equipment in fiber processing analogy.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Submit blade specs showing diamond-wire for semiconductor materials only
• Document integration with crystal pullers (8445 auxiliaries) for correct heading