8448.32.00.90/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Wafer polishers achieve mirror-flat surfaces on semiconductor wafers for fabrication, as 'other' accessories under HTS 8448.32.0090 for heading 8445 machines. Directly matches statistical note for lappers/polishers in wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Provide CMP slurry compatibility docs for semiconductor specificity

• Avoid generic 'polishing machine' descriptions to stay in fiber prep