Semiconductor Wafer Polisher from China
Wafer polishers achieve mirror-flat surfaces on semiconductor wafers for fabrication, as 'other' accessories under HTS 8448.32.0090 for heading 8445 machines. Directly matches statistical note for lappers/polishers in wafer preparation.
Duty Rate — China → United States
17.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Provide CMP slurry compatibility docs for semiconductor specificity
• Avoid generic 'polishing machine' descriptions to stay in fiber prep