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8448.32.00.90/Crystal boule Slicer Blade Assembly/Japan

Crystal boule Slicer Blade Assembly from Japan

Specialized blade assemblies for inner-diameter saws slicing semiconductor boules into wafers, classified as accessories in HTS 8448.32.0090 for 8445 prep machines. Matches note (B) wafer slicing saw components.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify blade material (nickel-phosphorus bonded diamond) for exclusivity

• Include wear-part replacement logs for ongoing 8445 use proof