Crystal boule Slicer Blade Assembly from Japan
Specialized blade assemblies for inner-diameter saws slicing semiconductor boules into wafers, classified as accessories in HTS 8448.32.0090 for 8445 prep machines. Matches note (B) wafer slicing saw components.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify blade material (nickel-phosphorus bonded diamond) for exclusivity
• Include wear-part replacement logs for ongoing 8445 use proof