Crystal boule Slicer Blade Assembly from Germany
Specialized blade assemblies for inner-diameter saws slicing semiconductor boules into wafers, classified as accessories in HTS 8448.32.0090 for 8445 prep machines. Matches note (B) wafer slicing saw components.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify blade material (nickel-phosphorus bonded diamond) for exclusivity
• Include wear-part replacement logs for ongoing 8445 use proof