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Boule Diameter Grinder from Japan

Boule diameter grinders reduce crystal boules to uniform wafer-matching diameters, fitting HTS 8448.32.0090 as parts for textile fiber prep machines (8445). Per notes, used in semiconductor crystal grinding for precise wafer production.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Invoice with diameter tolerance specs (e.g

±0.1mm for 300mm wafers)

Link to specific boule puller models for principal use evidence

Boule Diameter Grinder from Japan — Import Duty Rate | HTS 8448.32.00.90