Boule Diameter Grinder from Japan
Boule diameter grinders reduce crystal boules to uniform wafer-matching diameters, fitting HTS 8448.32.0090 as parts for textile fiber prep machines (8445). Per notes, used in semiconductor crystal grinding for precise wafer production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Invoice with diameter tolerance specs (e.g
• ±0.1mm for 300mm wafers)
• Link to specific boule puller models for principal use evidence