8448.20.50/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Wafer lapping equipment that removes material from semiconductor wafers using abrasive slurries to achieve precise thickness uniformity. Under HTS 8448.20.50 as accessories for heading 8444 machines in semiconductor wafer preparation. Essential for total thickness variation (TTV) control before polishing.

Duty Rate — Japan → United States

13.3%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify slurry compatibility with silicon/gallium arsenide in technical docs

• Prove TTV control capability under 1 micron for proper classification

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8448.20.50