Wafer Lapping Machine from Japan

Wafer lapping equipment that removes material from semiconductor wafers using abrasive slurries to achieve precise thickness uniformity. Under HTS 8448.20.50 as accessories for heading 8444 machines in semiconductor wafer preparation. Essential for total thickness variation (TTV) control before polishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify slurry compatibility with silicon/gallium arsenide in technical docs

• Prove TTV control capability under 1 micron for proper classification