Other
Auxiliary machinery for use with machines of heading 8444, 8445, 8446 or 8447 (for example, dobbies, Jacquards, automatic stop motions and shuttle changing mechanisms); parts and accessories suitable for use solely or principally with the machines of this heading or of heading 8444, 8445, 8446 or 8447 (for example, spindles and spindle flyers, card clothing, combs, extruding nipples, shuttles, healds and heald-frames, hosiery needles): > Parts and accessories of machines of heading 8444 or of their auxiliary machinery: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8448.20.50
Float Zone Crystal Grower
Float zone crystal grower used to produce high-purity monocrystalline silicon boules via the float zone method for semiconductor wafer fabrication. Falls under HTS 8448.20.50 as other auxiliary machinery for heading 8444 machines in semiconductor material processing. Critical for achieving ultra-low impurity levels required in device manufacturing.
CMP Wafer Polisher
Chemical Mechanical Planarization (CMP) polisher for final surface preparation of semiconductor wafers prior to device fabrication. HTS 8448.20.50 as other parts of heading 8444 auxiliary machinery for wafer processing. Achieves atomic-level flatness required for photolithography.
Spindle Flyer Assembly
High-speed spindle flyers for ring spinning frames (heading 8444) that impart twist to yarn formation. Classified HTS 8448.20.50 as accessories principally used with spinning machinery. Critical for yarn tension control and balloon formation.
Jacquard Harness Assembly
Complex Jacquard harness systems with hooks and wires for pattern weaving on heading 8444 machines. Classified under HTS 8448.20.50 as auxiliary machinery parts for intricate textile designs. Enables unlimited pattern complexity through individual warp control.
Crystal Puller for Silicon Wafer Production
A crystal puller employing the Czochralski method to grow monocrystalline silicon boules from which semiconductor wafers are sliced. Classified under HTS 8448.20.50 as auxiliary machinery for machines of heading 8444 used in semiconductor wafer manufacturing processes. It enables the production of pure semiconductor material essential for device fabrication.
Crystal Boule Grinder
Precision crystal grinder that shapes semiconductor boules to exact diameters and grinds flats indicating conductivity type for wafer preparation. HTS 8448.20.50 classification as parts/accessories of heading 8444 auxiliary machinery for semiconductor processing. Ensures wafers meet strict dimensional tolerances.
Semiconductor Wafer Slicing Saw
Diamond wire wafer slicing saw designed to cut ultra-thin slices from monocrystalline semiconductor boules for device fabrication. Classified HTS 8448.20.50 as other auxiliary machinery for heading 8444 in wafer manufacturing equipment. Achieves kerf loss minimization critical for yield optimization.
Wafer Lapping Machine
Wafer lapping equipment that removes material from semiconductor wafers using abrasive slurries to achieve precise thickness uniformity. Under HTS 8448.20.50 as accessories for heading 8444 machines in semiconductor wafer preparation. Essential for total thickness variation (TTV) control before polishing.
Heald Frame Assembly for Textile Machinery
Precision heald frames and assemblies used in dobby mechanisms for warp control in weaving machines of heading 8444. Classified under HTS 8448.20.50 as parts and accessories suitable principally with textile processing machinery. Enables pattern formation through precise thread positioning.
Automatic Stop Motion Device
Electronic stop motion sensors for textile machines of heading 8444 that halt operations upon thread breakage detection. HTS 8448.20.50 as auxiliary machinery preventing production waste. Commonly used in high-speed spinning and weaving operations.
Wafer Edge Grinder
Specialized grinder for chamfering and profiling semiconductor wafer edges to prevent chipping during handling. HTS 8448.20.50 as wafer preparation equipment for heading 8444 machines. Maintains edge strength critical for automated processing.