Wafer Lapping Machine from Germany
Wafer lapping equipment that removes material from semiconductor wafers using abrasive slurries to achieve precise thickness uniformity. Under HTS 8448.20.50 as accessories for heading 8444 machines in semiconductor wafer preparation. Essential for total thickness variation (TTV) control before polishing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify slurry compatibility with silicon/gallium arsenide in technical docs
• Prove TTV control capability under 1 micron for proper classification