Wafer Lapping Machine from Canada
Wafer lapping equipment that removes material from semiconductor wafers using abrasive slurries to achieve precise thickness uniformity. Under HTS 8448.20.50 as accessories for heading 8444 machines in semiconductor wafer preparation. Essential for total thickness variation (TTV) control before polishing.
Duty Rate — Canada → United States
13.3%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry compatibility with silicon/gallium arsenide in technical docs
• Prove TTV control capability under 1 micron for proper classification