Wafer Edge Grinder from China

Specialized grinder for chamfering and profiling semiconductor wafer edges to prevent chipping during handling. HTS 8448.20.50 as wafer preparation equipment for heading 8444 machines. Maintains edge strength critical for automated processing.

Duty Rate — China → United States

23.3%

Rate breakdown

9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Demonstrate edge break strength specifications for classification

• Include handling system compatibility documentation