Wafer Edge Grinder from Canada
Specialized grinder for chamfering and profiling semiconductor wafer edges to prevent chipping during handling. HTS 8448.20.50 as wafer preparation equipment for heading 8444 machines. Maintains edge strength critical for automated processing.
Duty Rate — Canada → United States
13.3%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Demonstrate edge break strength specifications for classification
• Include handling system compatibility documentation