8448.20.50/Semiconductor Wafer Slicing Saw/Mexico

Semiconductor Wafer Slicing Saw from Mexico

Diamond wire wafer slicing saw designed to cut ultra-thin slices from monocrystalline semiconductor boules for device fabrication. Classified HTS 8448.20.50 as other auxiliary machinery for heading 8444 in wafer manufacturing equipment. Achieves kerf loss minimization critical for yield optimization.

Duty Rate — Mexico → United States

13.3%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include saw blade specifications showing diamond wire for semiconductor materials only

• Customs may require proof of boule slicing function vs. general sawing capability

Semiconductor Wafer Slicing Saw from Mexico — Import Duty Rate | HTS 8448.20.50