Semiconductor Wafer Slicing Saw from Mexico
Diamond wire wafer slicing saw designed to cut ultra-thin slices from monocrystalline semiconductor boules for device fabrication. Classified HTS 8448.20.50 as other auxiliary machinery for heading 8444 in wafer manufacturing equipment. Achieves kerf loss minimization critical for yield optimization.
Duty Rate — Mexico → United States
13.3%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include saw blade specifications showing diamond wire for semiconductor materials only
• Customs may require proof of boule slicing function vs. general sawing capability