Semiconductor Wafer Slicing Saw from Japan
Diamond wire wafer slicing saw designed to cut ultra-thin slices from monocrystalline semiconductor boules for device fabrication. Classified HTS 8448.20.50 as other auxiliary machinery for heading 8444 in wafer manufacturing equipment. Achieves kerf loss minimization critical for yield optimization.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include saw blade specifications showing diamond wire for semiconductor materials only
• Customs may require proof of boule slicing function vs. general sawing capability