Crystal Puller for Silicon Wafer Production from Japan
A crystal puller employing the Czochralski method to grow monocrystalline silicon boules from which semiconductor wafers are sliced. Classified under HTS 8448.20.50 as auxiliary machinery for machines of heading 8444 used in semiconductor wafer manufacturing processes. It enables the production of pure semiconductor material essential for device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify the equipment is specifically designed for use with heading 8444 machines via manufacturer specs to avoid misclassification
• Include detailed technical documentation proving semiconductor wafer processing function during customs entry