Crystal Boule Grinder from Japan
Precision crystal grinder that shapes semiconductor boules to exact diameters and grinds flats indicating conductivity type for wafer preparation. HTS 8448.20.50 classification as parts/accessories of heading 8444 auxiliary machinery for semiconductor processing. Ensures wafers meet strict dimensional tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flat-grinding function for conductivity indication to prove semiconductor-specific use
• Maintain calibration certificates showing micron-level precision required for wafers