CMP Wafer Polisher from China
Chemical Mechanical Planarization (CMP) polisher for final surface preparation of semiconductor wafers prior to device fabrication. HTS 8448.20.50 as other parts of heading 8444 auxiliary machinery for wafer processing. Achieves atomic-level flatness required for photolithography.
Duty Rate — China → United States
23.3%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document CMP slurry and pad systems designed for oxide/nitride polishing
• Include planarization rate specs proving semiconductor application
• Avoid misclassification as general polishers (8460) by showing nanometer surface roughness capability