CMP Wafer Polisher from Canada
Chemical Mechanical Planarization (CMP) polisher for final surface preparation of semiconductor wafers prior to device fabrication. HTS 8448.20.50 as other parts of heading 8444 auxiliary machinery for wafer processing. Achieves atomic-level flatness required for photolithography.
Duty Rate — Canada → United States
13.3%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document CMP slurry and pad systems designed for oxide/nitride polishing
• Include planarization rate specs proving semiconductor application
• Avoid misclassification as general polishers (8460) by showing nanometer surface roughness capability