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8445.90.00.00/Wafer Thickness Grinder/Mexico

Wafer Thickness Grinder from Mexico

Backside grinder that thins semiconductor wafers from typical 700μm to 50-100μm for advanced packaging applications. Classified under HTS 8445.90.00.00 for wafer preparation grinders.

Duty Rate — Mexico → United States

13.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify final thickness tolerance (e.g

• ±1μm) proving semiconductor use

• Document temporary bonding/ debonding capability

Wafer Thickness Grinder from Mexico — Import Duty Rate | HTS 8445.90.00.00