8445.90.00.00/Wafer Thickness Grinder/Japan

Wafer Thickness Grinder from Japan

Backside grinder that thins semiconductor wafers from typical 700μm to 50-100μm for advanced packaging applications. Classified under HTS 8445.90.00.00 for wafer preparation grinders.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify final thickness tolerance (e.g

• ±1μm) proving semiconductor use

• Document temporary bonding/ debonding capability