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8445.90.00.00/Wafer Thickness Grinder/Germany

Wafer Thickness Grinder from Germany

Backside grinder that thins semiconductor wafers from typical 700μm to 50-100μm for advanced packaging applications. Classified under HTS 8445.90.00.00 for wafer preparation grinders.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify final thickness tolerance (e.g

• ±1μm) proving semiconductor use

• Document temporary bonding/ debonding capability

Wafer Thickness Grinder from Germany — Import Duty Rate | HTS 8445.90.00.00