Wafer Thickness Grinder from Germany
Backside grinder that thins semiconductor wafers from typical 700μm to 50-100μm for advanced packaging applications. Classified under HTS 8445.90.00.00 for wafer preparation grinders.
Duty Rate — Germany → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify final thickness tolerance (e.g
• ±1μm) proving semiconductor use
• Document temporary bonding/ debonding capability