</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8445.90.00.00/Wafer Thickness Grinder/China

Wafer Thickness Grinder from China

Backside grinder that thins semiconductor wafers from typical 700μm to 50-100μm for advanced packaging applications. Classified under HTS 8445.90.00.00 for wafer preparation grinders.

Duty Rate — China → United States

23.7%

Rate breakdown

9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify final thickness tolerance (e.g

• ±1μm) proving semiconductor use

• Document temporary bonding/ debonding capability

Wafer Thickness Grinder from China — Import Duty Rate | HTS 8445.90.00.00