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Wafer Edge Grinder from Mexico

Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.

Duty Rate — Mexico → United States

13.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Specify edge profiles (e.g

full bevel, half bevel) and wafer sizes supported

Provide handling capacity for 200mm/300mm wafers