Wafer Edge Grinder from Germany
Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.
Duty Rate — Germany → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge profiles (e.g
• full bevel, half bevel) and wafer sizes supported
• Provide handling capacity for 200mm/300mm wafers