Wafer Edge Grinder from Germany
Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profiles (e.g
• full bevel, half bevel) and wafer sizes supported
• Provide handling capacity for 200mm/300mm wafers