Wafer Edge Grinder from Germany
Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify edge profiles (e.g
• full bevel, half bevel) and wafer sizes supported
• Provide handling capacity for 200mm/300mm wafers