Wafer Edge Grinder from China
Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.
Duty Rate — China → United States
23.7%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Specify edge profiles (e.g
• full bevel, half bevel) and wafer sizes supported
• Provide handling capacity for 200mm/300mm wafers