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8445.90.00.00/Wafer Edge Grinder/China

Wafer Edge Grinder from China

Specialized grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. Falls under HTS 8445.90.00.00 as wafer preparation equipment for bringing wafers within dimensional tolerances.

Duty Rate — China → United States

23.7%

Rate breakdown

9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Specify edge profiles (e.g

• full bevel, half bevel) and wafer sizes supported

• Provide handling capacity for 200mm/300mm wafers