Semiconductor Wafer Lapper from Mexico
Machine that uses loose abrasive slurry to lap both sides of semiconductor wafers simultaneously, achieving precise flatness for fabrication processes. HTS 8445.90.00.00 per statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document total thickness variation (TTV) specs proving semiconductor tolerances
• Include slurry handling system details in technical description