</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8445.90.00.00/Semiconductor Wafer Lapper/Japan

Semiconductor Wafer Lapper from Japan

Machine that uses loose abrasive slurry to lap both sides of semiconductor wafers simultaneously, achieving precise flatness for fabrication processes. HTS 8445.90.00.00 per statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Document total thickness variation (TTV) specs proving semiconductor tolerances

• Include slurry handling system details in technical description

Semiconductor Wafer Lapper from Japan — Import Duty Rate | HTS 8445.90.00.00