Semiconductor Wafer Lapper from Germany
Machine that uses loose abrasive slurry to lap both sides of semiconductor wafers simultaneously, achieving precise flatness for fabrication processes. HTS 8445.90.00.00 per statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document total thickness variation (TTV) specs proving semiconductor tolerances
• Include slurry handling system details in technical description