Semiconductor Wafer Lapper from China
Machine that uses loose abrasive slurry to lap both sides of semiconductor wafers simultaneously, achieving precise flatness for fabrication processes. HTS 8445.90.00.00 per statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers.
Duty Rate — China → United States
23.7%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document total thickness variation (TTV) specs proving semiconductor tolerances
• Include slurry handling system details in technical description