Semiconductor Wafer Lapper from Canada
Machine that uses loose abrasive slurry to lap both sides of semiconductor wafers simultaneously, achieving precise flatness for fabrication processes. HTS 8445.90.00.00 per statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers.
Duty Rate — Canada → United States
13.7%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document total thickness variation (TTV) specs proving semiconductor tolerances
• Include slurry handling system details in technical description