Multi-Wire Wafer Slicing Saw from Mexico
Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Wire diameter and cut parallelism specs mandatory
• Distinguish from single blade saws
• Document slurry recirculation system