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8445.90.00.00/Multi-Wire Wafer Slicing Saw/Japan

Multi-Wire Wafer Slicing Saw from Japan

Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Wire diameter and cut parallelism specs mandatory

• Distinguish from single blade saws

• Document slurry recirculation system

Multi-Wire Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8445.90.00.00