Multi-Wire Wafer Slicing Saw from Germany
Advanced saw using multiple diamond-coated wires to simultaneously slice hundreds of wafers from a single boule, improving yield. Classified HTS 8445.90.00.00 statistical note (a)(ii)(B).
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Wire diameter and cut parallelism specs mandatory
• Distinguish from single blade saws
• Document slurry recirculation system