Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact diameter and grinds orientation flats indicating conductivity type and resistivity. Falls under HTS 8445.90.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment in semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit boule diameter specs and flat grinding tolerances to confirm wafer prep classification
• Pair with end-use statement for semiconductor boule processing