Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact diameter and grinds orientation flats indicating conductivity type and resistivity. Falls under HTS 8445.90.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment in semiconductor processing.
Duty Rate — Japan → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit boule diameter specs and flat grinding tolerances to confirm wafer prep classification
• Pair with end-use statement for semiconductor boule processing